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ASTM B 32 Standard Specification for Solder Metal


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ASTM B 32 Document Information:

Title
Standard Specification for Solder Metal

ASTM International

Publication Date:
May 1, 2008

Scope:

This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony- copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC – Association Connecting Electronic Industries.

These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).

This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.

The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.

Keywords:

bar
flux
flux cored solder
ingot
lead-silver alloys
lead-tin alloys
lead-tin-silver alloys
powder
ribbon
solder alloy
solder metal
solder uses
tin-antimony alloys
tin-copper alloys
tin-silver alloys
wire

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